Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF PRODUCING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS5935429
Kind Code:
A
More Like This:
JP5309495Manufacturing method of semiconductor devices
JP2000135476SUBSTRATE SURFACE TREATING DEVICE
JP4519575Systems and methods for characterizing textured surfaces
Inventors:
JIYAGUTAA SHIN BASHI
ERITSUKU MANDERU
Application Number:
JP8285483A
Publication Date:
February 27, 1984
Filing Date:
May 13, 1983
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IBM
International Classes:
H01L21/304; C09G1/02; H01L21/306; (IPC1-7): H01L21/304
Domestic Patent References:
JPS5099685A1975-08-07
Foreign References:
US3966432A1976-06-29
US4169796A1979-10-02
Attorney, Agent or Firm:
Tsukio Okada



 
Previous Patent: A read controller, a reading system, and a program

Next Patent: MANUFACTURE OF SEMICONDUCTOR DEVICE