Title:
HIGH-SPEED SILVER PLATING SOLUTION
Document Type and Number:
Japanese Patent JPS60159190
Kind Code:
A
Abstract:
PURPOSE:To obtain a high-speed silver plating soln. maintaining its satisfactory silver substitution preventing effect even at a temp. at which a plating soln. is generally used, by adding a heterocyclic compound contg. nitrogen, a silver alkali cyanide and a salt which improves the electric conductivity of a bath and buffers the bath at a prescribed pH. CONSTITUTION:This high-speed silver plating soln. contains 20-500mg/l heterocyclic compound contg. nitrogen, a silver alkali cyanide such as KAg(CN)2 and a salt which improves the electric conductivity of the bath and buffers the bath at 7.5-9.0pH. The salt includes K2HPO4. An Se compound may be added to the plating soln. so as to improve the luster of a plated film and to enable the formation of a thin plated film having no pinholes. 1,10-Phenanthroline or the like is used as the heterocyclic compound contg. nitrogen. It is desirable that the concn. of free cyanide in the plating soln. is kept at <=5g/l.
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Inventors:
OOKUBO RIICHI
MORI YASUO
KASAI SHIYUNICHI
MORI YASUO
KASAI SHIYUNICHI
Application Number:
JP1205584A
Publication Date:
August 20, 1985
Filing Date:
January 27, 1984
Export Citation:
Assignee:
NIPPON MINING CO
International Classes:
C25D3/46; (IPC1-7): C25D3/46
Domestic Patent References:
| JPS60159189A | 1985-08-20 |
Attorney, Agent or Firm:
Hiroshi Namikawa