Title:
GUIDING MECHANISM OF METAL DIE FOR SEMICONDUCTOR MOLD
Document Type and Number:
Japanese Patent JPS59172240
Kind Code:
A
Abstract:
PURPOSE:To improve the accuracy of locating mold metal die preventing the titled guiding mechanism from seizure in case of locating by a method wherein circular frexible parts, a holding frame containing the parts and a stacked layer stay depressing multiple circular frexible part stacked in the holding frame are provided in the titled guide unit. CONSTITUTION:Circular frexible part 11 with their sectional thickness internally diminished are provided with internally inclined structure. Therefore the frexible parts 11 as a whole are provided with projections 11a diagonally projected downward inside guide bushe 4. Moreover, the stacked frexible parts 11 are held by a holding frame 13 whereon said stacked frexible parts 11 are pushed to inner wall of the holding frame 13 by means of a stacked layer stay 14. Furthermore, a circular flange 15 is provided on the upper peripheral surface of said holding frame 13 to fix a guide bush 4 to a lower mold base 3.
Inventors:
TSUNEHIRO TOSHIKATSU
Application Number:
JP4545083A
Publication Date:
September 28, 1984
Filing Date:
March 18, 1983
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
B29B7/00; B29C39/00; B29C39/10; B29C39/26; H01L21/56; (IPC1-7): B29C5/00
Attorney, Agent or Firm:
Takehiko Suzue
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