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Title:
STRUCTURE OF PACKAGE FOR SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPS60124848
Kind Code:
A
Abstract:

PURPOSE: To prevent separation of an adhesive agent and thereby to improve sealing capability by a method wherein a protuberance is formed of the adhesive agent along the junction between a package upper cover and an ultraviolet light transmitting lid.

CONSTITUTION: An ultraviolet light transmitting lid 2 is fitted to a step 10 formed along a window 8 provided in an upper cover 1' formed out of thermoplastic resin sheet. An adhesive agent is applied to the junction between the step 10 and the lid 2 with the adhesive agent building a protuberance not lower than 100μm. The protuberance moderates the shear attributable to the difference in the rate of thermal expansion between the upper cover 1', the lid 2 and the adhesive agent. This keeps the adhesive agent from separation, which contributes to the realization of a package highly reliable in its sealing properties.


Inventors:
ARAI TOSHIYUKI
HAZAMA KEIJI
OOTA SHINICHI
KANAMARU KIICHI
Application Number:
JP23199883A
Publication Date:
July 03, 1985
Filing Date:
December 08, 1983
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G11C16/18; H01L21/00; H01L23/02; (IPC1-7): H01L23/02
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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