Title:
METHOD OF ELECTROPLATING
Document Type and Number:
Japanese Patent JPH04136198
Kind Code:
A
Abstract:
PURPOSE:To obtain an excellent decorating effect by dipping an electrode and a material to be plated in a plating bath containing plural metal plating components and varying the relative position of the electrode and the material while varying the plating voltage applied between them. CONSTITUTION:A plating tank 1 is charged with a plating bath 2 containing at least two kinds of metal components having different precipitation potentials, into which an infusible electrode 3 and a material 4 to be plated are dipped. A DC power source 5 is connected to both of 3, 4 to apply plating voltage. The relative position between the electrode 3 and the material 4 is varied while the plating voltage applied between them is varied. By this method, a plating layer having continuous variation of color tone and gloss can be formed on the material to be plated.
Inventors:
KANESHIRO YOSHIO
Application Number:
JP25433890A
Publication Date:
May 11, 1992
Filing Date:
September 26, 1990
Export Citation:
Assignee:
NAU KEMIKARU YUUGEN
International Classes:
C25D5/04; C25D21/00; (IPC1-7): C25D5/04; C25D21/00
Attorney, Agent or Firm:
Takushi Otsu