Title:
HIGH-TEMPERATURE DEVICE FOR SAMPLE
Document Type and Number:
Japanese Patent JPS5821531
Kind Code:
A
Abstract:
PURPOSE: To prevent burnout of a thermocouple, by using an alloy of tungsten rhenium as a material of a thermocouple.
CONSTITUTION: An alloy of 95% tungsten and 5% rhenium is used as a material of a thermocouple at a plus side, and an alloy of 74% tungsten and 26% rhenium is used at a minum side. the thermocouple is used with temperature control for a high-temperature device for a sample.
Inventors:
OGUCHI TAMIO
Application Number:
JP12112481A
Publication Date:
February 08, 1983
Filing Date:
July 31, 1981
Export Citation:
Assignee:
SUWA SEIKOSHA KK
International Classes:
G01N23/20; G01K7/02; G01K7/04; (IPC1-7): G01K7/02; G01N23/20
Attorney, Agent or Firm:
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