PRODUCTION OF RESIST STENCIL PATTERN FOR FORMING JUNCTION

Japanese Patent JPS6147678

A

PURPOSE:To uniformize the surface reflectives of a base electrode and of an interlayer insulation film and to enable a stencil pattern to be produced exactly according to the designed dimensions and with good reproducibility, by forming the interlayer insulation film into a sandwich structure consisting of metallic and insulation films having a surface reflectivity higher than that of an insulation film and a base electrode. CONSTITUTION:An insulator film 32a as the first layer is adhered on a substrate 31 to a thickness of about 60-180nm. A metallic film 35 as the second layer is adhered thereon to a thickness of about 30-80nm. Further, an insulation film 32b as the third layer is adhered thereon to a thickness of about 30-80nm. Thus formed is an interlayer insulation film 36 having a sandwich structure and a thickness of about 120-340nm in total. Subsequenly, the interlayer insulation film 36 is provided with a base electrode 33 and then with a resist for forming resist stencil patterns 34a and 34b for forming a junction. The resist is exposed to light with the use of a photomask pattern and developed so as to form resist stencil patterns 34a and 34b for forming a junction.

YAMADA KOJI
TARUYA YOSHINOBU
YANO SHINICHIRO
MIYAMOTO NOBUO
HIRANO MIKIO

JP16920784A

March 08, 1986

August 15, 1984

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AGENCY IND SCIENCE TECHN

H01L21/302; H01L21/027; H01L21/3065; H01L39/24; (IPC1-7): H01L21/302

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