Title:
FEEDING MECHANISM OF WIRE IN WIRE BONDING DEVICE
Document Type and Number:
Japanese Patent JPS5984535
Kind Code:
A
Abstract:
PURPOSE:To eliminate a mistake on the detection of the wire, and to supply the wire with high reliability by unfastening and delivering the wire from the upper side of a spool and providing the lower side of a wire path with a touch sensor detecting the wire. CONSTITUTION:The wire 2 brought to the state of (b) first is consumed by bonding work at the point of a capillary 8, and brought to the state of (a). When the wire 2 is brought to the state of (a), a signal from the touch sensor 3 is interrupted, the spool 1 is turned in the (e) direction by a driving motor, and the wire 2 is fed. The revolution of the spool 1 is continued up to the state of (b) in which the wire 2 forwarded from the spool 1 is in contact with the touch sensor 3. When the wire 2 forwarded from the spool 1 is attached to an adjacent wire or the spool 1 for some reasons at that time, the wire 2 is not brought to the state of (b) and is brought to the state of (c), but the state is caught by the touch sensor 3 and the revolution of the spool is stopped at that time. When the wire is consumed again from the state, the state of the wire is brought to (a) again, and the wire is bonded until all of the wire 2 on the spool are consumed.
Inventors:
IWATA MASANARI
Application Number:
JP19573782A
Publication Date:
May 16, 1984
Filing Date:
November 08, 1982
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JPS5129868A | 1976-03-13 |
Attorney, Agent or Firm:
Masuo Oiwa