Title:
SOLDER ALLOY
Document Type and Number:
Japanese Patent JPS59189096
Kind Code:
A
Abstract:
PURPOSE: To provide a solder alloy which is harmless, has excellent adhesive strength and operability, and reduces change in the lapse of time by mixing zinc, bismuth and tin in specific ratios.
CONSTITUTION: A solder alloy of the compsn. consisting of 5W15wt% zinc, 3W 20wt% bismuth and the balance tin is prepd. The solder alloy yields substantial adhesive strength (strength to removability) even if the working temp. is low and the content of zinc is relatively low; in addition, the alloy has the characteristic that reduces change in the lapse of time.
Inventors:
NARITA YUKIROU
TAGUCHI NARUTOSHI
KATOU RIKIYA
TAGUCHI NARUTOSHI
KATOU RIKIYA
Application Number:
JP6201783A
Publication Date:
October 26, 1984
Filing Date:
April 08, 1983
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
NIPPON CABLE SYSTEM INC
NIPPON CABLE SYSTEM INC
International Classes:
C22C13/00; B23K35/26; (IPC1-7): B23K35/26; C22C13/00
Domestic Patent References:
| JPS5711793A | 1982-01-21 | |||
| JPS5594455A | 1980-07-17 |
Attorney, Agent or Firm:
Kyozo Yuasa