PURPOSE: To stably support surface-mount ICs and the device on a substrate, and improve reliability of verification and analysis to surface-mount ICs, by electrically connecting a lead part of the surface-mount ICs with a corresponding pad part via an IC socket and an adapter.

CONSTITUTION: An adapter 6 is attached onto a printed-circuit board 1 by soldering a pattern 6 to a pad part 2, nextly an IC socket 4 is attached to the adapter 6 by inserting a socket lead part 4d into an adapter socket part 6b. After that, a surface-mount IC 3 is placed on a base 4a in such a war that its lead part overlaps respectively with corresponding pins 4e, then a lid 4b is closed to lock it. A lead part of the surface-mount IC 3 is electrically connected respectively with the corresponding pad part 2 via a pin 4e, a socket lead tart 4d, an adapter socket 6b, and a pattern 6a. Consequently, the surface- mount IC 3 and the device itself can be stably supported onto the substrate 1, and reliability of verification and analysis to a surface-mount IC 3 can be improved.