PURPOSE: To ensure bonding by an adhesive when a resin molded body is to be mounted on a wiring substrate, and to remove generation of a crack in the resin and exposure of a wire even when the resin molded body is made to have a tab lowered construction by a method wherein the base of the resin molded body is so formed as to make the central part thereof to be protruded out of the peripheral part.

CONSTITUTION: A semiconductor element 1, a tab 2 and leads 3 are built in an epoxy resin molded body 4, and outside leads 5 are bent downward from the sides of the resin molded body. Printed wirings 8 are provided according to metallization or sputtering of a metal, etc. on the surface of an insulating substrate 6 for wiring consisting of ceramics or epoxy resin. A protruded part 10 having the central part thereof more protruded than the peripheral part is formed to the base of the resin molded body 4. The protruded part 10 thereof is formed having the area of the degree of the half or less of the base area of the resin molded body, and height of the protruded part is made to 0.2mm or more. While, length of the outside leads is so selected as to make a gap (d) between the base of the resin molded body and the wiring substrate to become to the size of 0.2mm or more when the semiconductor device is mounted on the wiring substrate.