Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MANUFACTURE OF SUBSTRATE FOR SEMICONDUCTOR ELEMENT MOUNTING
Document Type and Number:
Japanese Patent JPS6124254
Kind Code:
A
Abstract:

PURPOSE: To prevent foam from generating in the glass part under the back surface of a pellet to be mounted by a method wherein low-melting point glass layers, each with a different working temperature, are disposed in the upper and lower two layers, the recess-shaped surface of the lower glass layer is filled with the upper glass layer and the surface is corrected into a flat or somewhat protruded configuration.

CONSTITUTION: A first-layer low-melting point glass layer 6 is made a screen printing on a die attaching surface 3 in the cavity 2 of a ceramic substrate 1. Then, the low-melting point glass layer 6 is backed while being flowed in up to the sidewall of the cavity 2. A second-layer low- melting point glass layer 7 of the working temperature lower than that of the first-layer low- melting point glass layer 6 is made a screen printing on the above-mentioned glass layer 6 in such a way that the recessed configuration of the surface of the first-layer glass layer 6 is filled with the glass layer 7. The second-layer low-melting point glass layer 7 is sintered at the temperature lower than the working temperature of the first-layer glass layer 6 and higher than the working temperature of the second-layer glass layer 7. When a pellet is mounted, no foam is generated in the glass part under the back surface of the pellet, because the die attaching surface of the ceramic substrate manufactured in such a way is formed into a recessed con figuration or a flat configuration, or a somewhat gently protruded configuration. As a result, a good glass mounting can be performed.


Inventors:
KINOSHITA TAKASHI
Application Number:
JP14541284A
Publication Date:
February 01, 1986
Filing Date:
July 13, 1984
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORP
International Classes:
H01L23/12; H01L21/52; H01L21/58; H01L23/15; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Sugano Naka