Title:
DRYING APPARATUS FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPS5831534
Kind Code:
A
Abstract:
PURPOSE:To make it possible to completely remove the water remaining a semiconductor substrate drying apparatus which may draw in dust and cause the same to attach to a semiconductor substrate, by additionally providing a heating mechanism to a centrifugal dryer. CONSTITUTION:A plurality of semiconductor substrates 1 having been subjected to a washing step are placed in a frame-like case 2 and mounted on a support frame 12 of a rotary member 4. When the rotary member 4 is rotared at high speed, the semiconductor substrares 1 are rotated integrally therewith. the greater part of drops of water removed by means of the action of centrifugal force flow down along an inner wall surface 5, but some of them are scattered as a spray. Since a container 3 is heated to higher than 50 deg.C by means of a heater 11, the water drops which have flowed down along the inner wall surface 5 and gathered on a bottom part 6 are promptly heated up and evaporated. Accordingly, the inner wall surface 5 and the bottom part 6 are dried, so that corrosion can be prevented. In addition, any dust or the like entering through a drain port 7 will not be drawn in, since there is no residual water 8. Thereby, adhesion of dust or the like to the semiconductor substrates 1 is prevented. Moreover, since also a drain pipe 10 is kept heated, there is no residual water 8 flowing back into the container 3.
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Inventors:
NIHEI HIROYUKI
Application Number:
JP12903081A
Publication Date:
February 24, 1983
Filing Date:
August 18, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/304; H01L21/00; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Takehiko Suzue