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Patent Searching and Data


Title:
PREPARATION OF SILICONE RUBBER MOLDED PIECE IN HIGH TEMPERATURE REGION
Document Type and Number:
Japanese Patent JPS6023018
Kind Code:
A
Abstract:

PURPOSE: To make possible dip molding in a high temperature region and to obtain the title molding uniform in thickness and quality by applying addition reaction hardening liquid silicone rubber compound containing inorganic filler with specified viscosity and pot life.

CONSTITUTION: First, the viscosity and pot life of the additional reaction hardening liquid silicone rubber compound containing inorganic filler is controlled generally by means of hardening retarder and viscosity adjuster so that the viscosity of said compound at 250°C is 10W1,000,000 centipoises and the pot life thereof is 30 days min. The mold in the region of 150W250°C is dipped in said compound, preferably, for 1secW10min, then, drawn up and a molded piece is released from the mold and obtained in the desired form.

EFFECT: Foamless, stable molded pieces are obtained continuously.


Inventors:
NAKAMURA TOSHINOBU
Application Number:
JP6517783A
Publication Date:
February 05, 1985
Filing Date:
April 15, 1983
Export Citation:
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Assignee:
SHINAGAWA SHIYOUKOU KK
International Classes:
B29C41/14; B29K83/00; (IPC1-7): B29C41/14; B29K83/00
Domestic Patent References:
JPS54117556A1979-09-12
Attorney, Agent or Firm:
Yashima Keiichi