MANUFACTURE OF SEMICONDUCTOR DEVICE

Title:

MANUFACTURE OF SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPS5856430

Kind Code:

A

Abstract:

PURPOSE:To avoid the deterioration or the damage of a semiconductor chip occurred in case of coupling electrodes by superposing conductor electrodes of an insulating foil or a substrate formed with the electrode on a conductor electrode of the chip and emitting a light through a wedge formed of a material passing the light. CONSTITUTION:An insulating film (foil) or a substrate 1 has conductor electrodes 2, and a semiconductor chip 3 is installed directly under the film or the substrate 1. In this case, the conductors 2 to be further coupled and conductor electrodes 4 formed on the chip 3 are mutually positioned and superposed, and a wedge 6 made of a material passing a light beam or a laser light is thereafter installed on the film or the substrate 1 above the electrodes 2 or 4 from above. Then, only the electrodes 2, and 4 are locally heated with the light beam or the laser beam, thereby connecting the electrodes 2 and 4.

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Inventors:

SAKAI KIYOSHI

Application Number:

JP15569081A

Publication Date:

April 04, 1983

Filing Date:

September 30, 1981

Export Citation:

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