SEMICONDUCTOR DEVICE - HITACHI MICROCUMPUTER ENG

Title:

SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPS59188150

Kind Code:

A

Abstract:

PURPOSE: To mount a semiconductor in a high density by forming the wire bonding surface of an insulating substrate and a cap sealing surface in the same plane, thereby reducing the size of the profile of the substrate.

CONSTITUTION: A bonding pad of a semiconductor pellet 2 which is mounted by a solder material 4 of gold-silicon on a pellet mounting surface 5 in a cavity 3 of an insulating substrate 1 of a package is electrically connected to metallized wirings of the wire bonding surface of the substrate 1 via a wire 6. The wire bonding surface is formed in the same plane as the sealing surface of a cap 8, and the cap 8 is hermetically sealed through a low melting point glass 9 on an insulating film 12. Thus, a wire bonding and a cap sealing can be achieved in a narrow area, thereby reducing the size of the insulator 1.

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Inventors:

OZAKI HIROSHI
OKINAGA TAKAYUKI
OOTSUKA KANJI

Application Number:

JP6088883A

Publication Date:

October 25, 1984

Filing Date:

April 08, 1983

Export Citation:

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Assignee:

HITACHI MICROCUMPUTER ENG
HITACHI LTD

International Classes:

H01L23/12; H01L21/60; H01L23/02; H01L23/04; H01L23/10; (IPC1-7): H01L23/02; H01L23/12; H01L23/48

Attorney, Agent or Firm:

Akio Takahashi

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