PURPOSE: To obtain the titled adhesive excellent in bondability, adhesion, flexibility, and thermal shock resistance, by providing both sides of a particular film base with a thermosetting polybutadiene-modified epoxy resin layer.
CONSTITUTION: Polybutadiene having a carboxyl group in the molecule is reacted with an epoxy resin other than those having two α,β-epoxy groups with a methyl group at the β position to yield a thermosetting polybutadiene-modified epoxy resin, with which a hardener, radical polymn. initiator, filler, flame retardant, solvent, etc. are incorporated to yield a resin compsn. Said compsn. is applied in a thickness of 10W200μ onto both sides of a film base, 5W150μ thick, which has self-supporting properties at ordinary temp. and does not melt by heat during bonding, and dried to yield a film adhesive. Said adhesive is then held between both adherends and cured by heating at 100W180°C under pressure.
HIGASHIDA SHIROU
SAITOU NORIYOSHI
