PURPOSE: To provide titled composition of excellent surface-curability and high adhesive potential, comprising a vinyl ester oligomer, a liquid acrylic monomer and/or methacrylic monomer and/or oligomer thereof, and a photopolymerization initiator.
CONSTITUTION: The objective photosensitive resin composition can be obtained by incorporating (A) a total of, pref. 20W80wt% of a vinyl ester oligomer (e.g., an epoxy acrylate of formula I ) and a liquid acrylic monomer and/or a methacrylic monomer and/or oligomer(s) thereof [for example, a compound of formula II (R1 is expressed by formula III; R2 is H or CH3; n s 1 or 2) such as neopentyl glycol diacrylate] with (B) pref. 0.5W5wt% of a photopolymerization initiator (e.g. hydroxyisopropylphenone) and, if required, (C) a coupling agent, a pigment, and a filler.
IKENO SHINOBU