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Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS594612
Kind Code:
A
Abstract:

PURPOSE: To provide titled composition of excellent surface-curability and high adhesive potential, comprising a vinyl ester oligomer, a liquid acrylic monomer and/or methacrylic monomer and/or oligomer thereof, and a photopolymerization initiator.

CONSTITUTION: The objective photosensitive resin composition can be obtained by incorporating (A) a total of, pref. 20W80wt% of a vinyl ester oligomer (e.g., an epoxy acrylate of formula I ) and a liquid acrylic monomer and/or a methacrylic monomer and/or oligomer(s) thereof [for example, a compound of formula II (R1 is expressed by formula III; R2 is H or CH3; n s 1 or 2) such as neopentyl glycol diacrylate] with (B) pref. 0.5W5wt% of a photopolymerization initiator (e.g. hydroxyisopropylphenone) and, if required, (C) a coupling agent, a pigment, and a filler.


Inventors:
MIWA AKITSUGU
IKENO SHINOBU
Application Number:
JP11438782A
Publication Date:
January 11, 1984
Filing Date:
June 30, 1982
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08F2/00; C08F2/48; C08F20/00; C08F20/10; C08F220/28; C08F290/00; C08F299/00; C08F299/02; C09D5/00; C09D101/18; C09D167/07; (IPC1-7): C08F2/48; C08F220/28; C08F299/02; C09D3/16; C09D5/00; G03C1/68
Attorney, Agent or Firm:
Toshimaru Takemoto