PURPOSE: To obtain a homogeneous copper film having high adhesive strength by chemically plating the surface of stainless steel with copper after baking the steel in an oxidizing atmosphere.

CONSTITUTION: Stainless steel is baked at 250W550°C, especially 300W450°C in an oxidizing atmosphere for 5W180min, especially 10W60min to form a ferric oxide- base oxidized film. The surface of the baked steel is chemically plated with copper. It is preferable that the surface of the baked stainless steel is activated with an aqueous palladium chloride soln. before carrying out the chemical copper plating.