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Patent Searching and Data


Title:
RESIN COMPOSITION CONTAINING INORGANIC REINFORCING AGENT
Document Type and Number:
Japanese Patent JPS5840344
Kind Code:
A
Abstract:

PURPOSE: To provide the titled resin compsn. having improved heat distortion temperature, by copolymerizing two specified kinds of vinyl monomers or oligomers in the presence of a radical polymn. initiator and B2O3.

CONSTITUTION: 0.5W2pts.wt. radical polymn. initiator such as benzoyl peroxide and 10W80pts.wt. amorphous B2O3 powder having a particle size of 100μ or below, are mixed with 100pts.wt. mixture consisting of 10W60pts.wt. epoxy group-contg. vinyl monomer (A) or oligomer thereof such as glycidyl methacrylate and 90W40pts.wt. vinyl monomer (B) other than component A or oligomer thereof such as methyl methacrylate. The resulting mixture is cast into a suitable mold, and cured by heating.

EFFECT: The product shows an increase in glass transition temperature several tens of degrees higher than that of a product to which B2O3 powder is not added.


Inventors:
IIZAKA KATSUYOSHI
MITANI TETSUO
Application Number:
JP14010081A
Publication Date:
March 09, 1983
Filing Date:
September 04, 1981
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C08F2/00; C08F2/44; C08F16/00; C08F16/14; C08F16/26; C08F20/00; C08F20/32; C08K3/38; C08L57/10; (IPC1-7): C08F2/44; C08K3/38; C08L57/10
Attorney, Agent or Firm:
Shinichi Kusano