Title:
PRODUCTION OF OPTICAL SEMICONDUCTOR ELEMENT MODULE
Document Type and Number:
Japanese Patent JPH04130308
Kind Code:
A
Abstract:
PURPOSE:To easily produce the optical semiconductor module by previously assembling a rod lens and an element package as an integrated unit, then assembling the respective assembly among constituting parts. CONSTITUTION:The rod lens 14 is fixed atop the glass window of the element package 13 by an optical adhesive B in contact therewith without optical axis adjustment so as to have a light transmission relation and thereafter, the solder paste A placed in the spacing existing with the window frame of the package 13 is backed or heated by high-frequency heating, etc., by which the rod lens is surely fixed to the package 13. The package 13 integrated with the lens 14 in such a manner is mounted and fixed in its flange part to the end face of a sleeve 15 by welding as shown in a weld zone C without optical axis adjustment. An optical fiber 11 is thereafter mounted and fixed via a fiber holder 12 by soldering or welding as shown by a weld zone D.
Inventors:
KANEKO SATOSHI
HIMI SUSUMU
USAMI MASAHIRO
SUZUKI MUNETOSHI
HIMI SUSUMU
USAMI MASAHIRO
SUZUKI MUNETOSHI
Application Number:
JP25018290A
Publication Date:
May 01, 1992
Filing Date:
September 21, 1990
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G02B6/42; H01L33/58; (IPC1-7): G02B6/42; H01L33/00
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)