Title:
VACUUM SUCKING STAND
Document Type and Number:
Japanese Patent JPS5943539
Kind Code:
A
Abstract:
PURPOSE:To eliminate the deformation of a wafer due to vacuum pressure as well as to enable to use the subject device for the wafers of different sizes by a method wherein a plurality of circular grooves are provided on the surface of the vacuum sucking stand, a plurality of horizontal holes are formed at the lower part of the vacuum sucking stand, and sucking holes connecting the horizontal hole and the groove are provided. CONSTITUTION:A plurality of circular grooves 11A-11D are provided on the surface of the vacuum sucking stand 10, a plurality of horizontal holes 12 and 13 are formed at the lower part of the vacuum sucking stand and the grooves 11A-11D and the horizontal holes 12 and 13 are connected by the sucking holes 14A-18B. Also, another sucking hole 16 is provided in the center of the groove 11A and it is connected to the horizontal hole 12. The wafers can be sucked completely by performing a vacuum air-intake from a nipple 22 only when a small wafer 30 is mounted, and a vacuum air-intake is performed from both nipples 22 and 23 when a large wafer 40 is mounted. Also, when the wafer is to be dismounted, the wafer can be separated from the vacuum sucking stand by releasing the vacuum state from the vacuum exhaust path and air is sent from a nipple 24.
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Inventors:
TAKAHASHI TATSUYA
Application Number:
JP15260782A
Publication Date:
March 10, 1984
Filing Date:
September 03, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Akio Takahashi
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