PURPOSE: To obtain a device of high reliability at a low cost by a method wherein a chip finished in element formation is buried in a heat resistant resin layer, a junction pad of the chip is connected to a lead frame, and then resin sealing is performed after coating a wiring with an insulation film.

CONSTITUTION: The chip 11 finished in element formation and the lead frame 14 are mounted on a metal mold 21, a wiring surface is kept on a plane, the heat resistant resin 22 is cast and hardened. A window is opened through the resin layer 22 on the junction pad 12 by applying a resist mask 7, and the wirings 24 are provided by vapor-depositing Cr, etc. on the layer 22. Further, an SiO2 protection film 25 is superposed and resin-sealed to a package 26. This constitution enables to reduce the cost by using Al, etc. for the pad; fixing strength is large, since one ends of the chip and the lead frame are buried in the resin; the wiring is protected with the insulation film, resulting in high moisture resistance, and accordingly the reliability remarkably improves.