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Title:
SEALING RESIN COMPOSITION CURABLE WITH ACTINIC ENERGY RADIATION
Document Type and Number:
Japanese Patent JPS60147424
Kind Code:
A
Abstract:

PURPOSE: To provide the titled composition having excellent adhesivity, sealing property, etc., and suitable for the sealing of the pouring gate of a liquid crystal cell, by mixing a cycloaliphatic epoxy resin having (meth)acryloyl group, a polybutadiene resin having (meth)acryloyl group, and a reactive diluent.

CONSTITUTION: The objective composition contains (A) a resin obtained by introducing acryloyl group and/or methacryloyl group to one or two epoxy groups of a cycloaliphatic epoxy resin (preferably 3,4-epoxycyclohexylmethyl-3,4-cyclohexanecarboxylate, (B) a resin containing polybutadiene (preferably having a number-average molecular weight of 500W10,000) as the skeleton of the main chain and having acryloyl group and/or methacryloyl group at the molecular terminal and/or side chain and (C0 a reactive diluent (e.g. acrylic acid). The amounts of the components A, B and C are preferably 20W60(wt)%, 10W60% and 3W40%, respectively.


Inventors:
YAMASE YUKIO
MORI ATSUSHI
TSUDA HIDEO
Application Number:
JP303384A
Publication Date:
August 03, 1985
Filing Date:
January 11, 1984
Export Citation:
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Assignee:
NIPPON SODA CO
International Classes:
C08F299/00; C08F2/46; C08F290/00; C08G59/00; C08G59/20; C08G59/40; G02F1/133; G02F1/1341; (IPC1-7): C08F2/46; C08F299/00; C08G59/20; G02F1/133
Attorney, Agent or Firm:
Yokoyama Yoshimi



 
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