PURPOSE: To absorb stress by expansion and shrinkage due to heat of the part itself without reducing the strength of the part of a lead terminal which is led out from a main body of the part by forming a thickness of the bent part of the lead terminal thinly.

CONSTITUTION: A lead terminal 7 is led out from a main body of electronic part 1 which is sealed by resin and comprises a bent part 8 and is connected to a conductor 4 formed on a wiring board 3 through solder 5. The connection part 9 of the part 6 formed thinner than the bent part 8 and the lead terminal 7 before and after said part 8 and which is led out from the resin seled main body 1 and the wiring board 3 is composed of a lead terminal of usual thickness.