Title:
METHOD OF PRODUCING PRINTED CIRCUIT BOARD FOR WIRING BONDING
Document Type and Number:
Japanese Patent JPS59188997
Kind Code:
A
Inventors:
YATSU HAJIME
KATSUKAWA HIROSHI
KATSUKAWA HIROSHI
Application Number:
JP6320683A
Publication Date:
October 26, 1984
Filing Date:
April 11, 1983
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/00; H05K3/06; H05K3/24; H05K3/44; (IPC1-7): H05K3/06; H05K3/44
Domestic Patent References:
| JPS55120194A | 1980-09-16 |