Title:
SEMICONDUCTOR ASSEMBLING DEVICE
Document Type and Number:
Japanese Patent JPS5955028
Kind Code:
A
Abstract:
PURPOSE:To perform wire bonding provided with wire collapse correction capacity, and to enhance yield and reliability of a semiconductor device by a method wherein a thrust up mechanism to push up a bonding wire is supplemented to a bonding mechanism. CONSTITUTION:The respective bonding connecting parts on the upper surface of a pellet 10 and at the tips of a lead frame 11 are connected with the wires 14, 14 according to the prescribed wire bonding mechanism. After the lead frame 11 is fixed as to position with the island 12 of the lead frame 11 right above the thrust up part 16, the thrust up part 16 is transferred upward up to the extent not to apply excess tension to the wires 14, 14, and the circumference of the island 12 pushes up the wires 14, 14. Then, the thrust up part 16 mentioned above is descended to be returned to the original position. The island 12 formed in one body with the lead frame 11 is also returned to the original position according thereto. At this time, because the wires are pushed up once, the collapsed part is collected to a natural curve.
Inventors:
NAKAGAWA HIROMICHI
Application Number:
JP16620282A
Publication Date:
March 29, 1984
Filing Date:
September 24, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Takehiko Suzue