METHOD AND DEVICE FOR PARTIAL PLATING

Japanese Patent JPS59107094

A

PURPOSE:To perform partial plating with high accuracy by enclosing the outside circumference of a material to be plated except the surface to be plated with inflow gas, injecting a plating soln. corresponding individually to each surface to be plated to bring the soln. into collision against the surface to be plated and removing the vector in a tZ-axis direction from the vector of the plating soln. flow after the collision. CONSTITUTION:A prescribed enclosing space 23 is formed on the side of the surface to be plated by a mask 21 and an outside housing box 26, and a plating soln. is injected to the surface to be plated of an object 4 to be plated in the space 23, whereby partial plating is accomplished. The inside of the space 23 is maintained under a negative pressure and the area of the aperture of the mask 21 is made larger than the area to be plated. The part to be plated is determined by the outside air flow introduced from the clearance 23 between both. The plating soln. flow which is regulated to have a flux having the sectional area smaller than the area of each part to be plated is injected to each part to be plated in the state of making a pair with each part to be plated. The vector in tZ-axis direction is removed from the vector of the plating soln. flow after collision against the part to be plated.

WO/1992/000404	PROCESS FOR PREPARING NONCONDUCTIVE SUBSTRATES
JP3644196	PRODUCTION OF THREE-DIMENSIONAL OBJECT
WO/2005/040461	METHOD AND SYSTEM FOR SELECTIVELY COATING METAL SURFACES

SHIMAMURA KOUICHI

JP21695082A

June 21, 1984

December 13, 1982

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SONIX KK

C25D5/02; C25D5/08; H01L23/50; (IPC1-7): C25D5/02; C25D5/08

JPS5274536A

1977-06-22

Susumu Ito

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