PURPOSE: To reduce man-hour by using an incorporated frame shield structure and applying soldering to parts requiring soldering such as soldering between printed wiring and components and soldering between a printed wiring board and the said structure by means of the solder dip method so as to avoid generation of solder balls.
CONSTITUTION: The frame shield structure consists of a rectangular frame where four side faces are bonded at four corners of the front side so as to form box formed four side faces and shield plates 22∼29 bonded respectively to the front side of the frame 21 and arranged so as to section the inside of the frame into plural sections. A strip metallic plate 36 is provided separately, an input/output terminal 37 is soldered to the metallic plate by means of the solder dip and after the printed wiring board 38 is mounted on the frame 21, the metallic plate 36 is mounted to the side face 35 of the frame.
KINDOU TAKASHI
YAMAZAKI NOBORU
| JPS58104534A | 1983-06-22 |
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