Title:
COMPOSITE PLATING METHOD
Document Type and Number:
Japanese Patent JPS5928596
Kind Code:
A
Abstract:
PURPOSE:To obtain a composite plating layer increased in an electrodeposition amount, by a method wherein an insoluble particle coated with a metal film is suspended in a plating bath and a plating metal and the aforementioned insoluble particle are simultaneously electrodeposited on an object to be plated to handle a particle hardly susceptible to electrodeposition as a conductive particle. CONSTITUTION:Pretreatment such as electroless plating is applied to an insoluble particle suspended in a plating bath to prepare an insoluble particle of which the surface is coated with a thin metal film. In the next step, a plating metal and the aforementioned pretreated insoluble particle are simultaneously electrodeposited on an object to be plated in an electroless plating bath to form a composite plating layer. As the aforementioned insoluble particle, a particle comprising carbide, oxide, nitride or an org. polymer is used. In addition, as the electroless plating metal, Ni, Ni-P, Ni-Co or the like are represented. In this case, metal film coating may be performed by a sputtering, a vapor deposition or an ion plating method.
Inventors:
KONDOU YUKIHIRO
Application Number:
JP13780582A
Publication Date:
February 15, 1984
Filing Date:
August 06, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C25D15/02; (IPC1-7): C25D15/02
Attorney, Agent or Firm:
Takehiko Matsumoto