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Title:
MICROWAVE INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JPS60116203
Kind Code:
A
Abstract:

PURPOSE: To attain sure electrical separation between a low frequency signal circuit part and a high frequency signal circuit part by providing an LPF consisting of the combination of a capacitor and a bonding wire to the low frequency circuit part.

CONSTITUTION: A pattern comprising microstrip lines 22∼25 or the like and a terminal pattern 26 for a low frequency signal input are formed at the upper side of a dielectric substrate 21 in an MIC circuit 20 for a phase modulator and slot lines 27∼29 formed by removing the metallized face and a terminal pattern 30 formed in isolation with the metallized face and connected electrically to the pattern 26 are formed at the power side. Parts B1, B2 of the lines 27, 28 are provided with a diode, which is connected to the terminal pattern 30 via a bonding wire 33 and a microchip capacitor 34. The wire 33 forms an inductance so as to constitute the LPF together with the capacitor 34, a low frequency signal inputted from the pattern 30 and a high frequency signal from an input P1 are separated surely so as to attain stably the operation of the phase modulator over a wide band.


Inventors:
SAKANE TOSHIROU
OOSAWA ZENICHI
AIKAWA MASAYOSHI
OGAWA HIROTSUGU
Application Number:
JP22219583A
Publication Date:
June 22, 1985
Filing Date:
November 28, 1983
Export Citation:
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Assignee:
FUJITSU LTD
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01P3/08; H03D7/14; H03D9/06; (IPC1-7): H01P3/08; H01P5/08; H03D7/14; H03D9/06
Domestic Patent References:
JPS5672505A1981-06-16
JPS5897946A1983-06-10
Attorney, Agent or Firm:
Aoki Akira



 
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