Title:
DETACHABLE MECHANISM OF WAFER
Document Type and Number:
Japanese Patent JPS60104682
Kind Code:
A
Inventors:
HIUGA KAZUAKI
Application Number:
JP21008283A
Publication Date:
June 10, 1985
Filing Date:
November 09, 1983
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/677; B25J15/00; H01L21/67; H01L21/68; (IPC1-7): B25J15/00; H01L21/68
Attorney, Agent or Firm:
Takehiko Suzue