WAFER CONVEYING TAPE

Japanese Patent JPS5917262

A

PURPOSE:To enable to handle wafers of a large number of sheets all together by a method wherein the wafers of a large number of sheets are arranged to be adhered regularly to adhesive tape, and the surfaces of the group of the wafers thereof are enabled to be covered with a sheet. CONSTITUTION:Adhesive tape 2 drawn out linearly is intermittently fed regularly by engaging the punched holes 4 thereof with the feeding claws of a feed roller 8. During stoppage of intermittent feed thereof, the wafers 9 are taken out one sheet by one sheet to be put in order on the adhering parts 3 of the adhesive tape 2. At this time, the wafers 9 are arranged in order on the tape 2 regularly being aligned with the pitch and the direction, etc. The wafers 9 put on the adhering parts 3 are adhered to be fixed to the adhering parts 3 being pressed by a pressure attachment device 11. The cover sheet 5 rolled round a reel 12 is coated being drawn out linearly in the horizontal direction on the group of the wafers 9 arranged regularly and adhered on the adhering parts 3. Because the wafers 9 are coated by the cover sheet 5 during conveyance, the surfaces of the wafers 9 can be prevented from adhesion of foreign matters of dust, etc., and generation of damage.

SANO YUUJI
KAGEYAMA JIYOUICHIROU

JP12578082A

January 28, 1984

July 21, 1982

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HITACHI LTD
HITACHI YONEZAWA DENSHI KK

B65G35/04; H01L21/00; H01L21/677; (IPC1-7): B65G35/04

Toshiyuki Usuda

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