Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LIGHT EMITTING MODULE
Document Type and Number:
Japanese Patent JPS59192218
Kind Code:
A
Abstract:

PURPOSE: To enhance the adehsive strength and to improve the reliability by providing a reinforcing ring for reinforcing adhesion parts of a light emitting element, an insulating ring, and a metallic cap.

CONSTITUTION: A metallic cap 13 is adhered onto an insulating ring 14, and the insulating ring 14 insulates a light emitting element substrate 9 and the metallic cap 13 from each other. An optical fiber 11 is fixed to the metallic cap 13 with an adhesive 15 by adhesion, and simultaneously, a fiber coating 12 is fixed by adhesion also. since the positional relation between the optical fiber 11 and a light emitting part 10 is determined by fixing of the optical fiber to the metallic cap 13, a reinforcing ring 16 having the insulating property is so covered that the metallic cap 13 is not moved for the substrate 9, and the ring 16 is fixed with an adhesive. Thus, the adhesive strength is enhanced to improve the reliability.


Inventors:
TOUJIYOU MASAAKI
YOSHINO MASAYASU
IIYAMA KEIICHI
Application Number:
JP6735583A
Publication Date:
October 31, 1984
Filing Date:
April 15, 1983
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G02B6/42; H01L33/48; (IPC1-7): G02B7/26; H01L33/00
Attorney, Agent or Firm:
Toshio Nakao



 
Previous Patent: JPS59192217

Next Patent: OPTICAL COUPLING METHOD