METHOD AND DEVICE FOR PHOTORESIST PROCESS CONTROL

Title:

METHOD AND DEVICE FOR PHOTORESIST PROCESS CONTROL

Document Type and Number:

Japanese Patent JPS597953

Kind Code:

A

Abstract:

PURPOSE: To improve the yield of semiconductor elements by measuring photoresist film pressure and controlling exposure time.

CONSTITUTION: This system consists of a resist drying temperature and time measuring device 15, a device 100 which inputs the kind of resist and exposure light wave length, a device 16 for measuring film thickness d0, a computer 200 (arithmetic routine 11 for uniform irradiation critical exposure energy ETU, arithmetic routine 12 for program exposure, arithmetic routine 13 for exposure, and arithmetic routine 14 for development time), a measuring device 17 for irradiation intensity I0, a controller 18 for exposure time, and a controller 19 for development time. Then, ETU is found from the absorption coefficient of the photoresist, optical characteristics of light sensitivity, development characteristics, and coated film thickness. Exposure energy D is found from the ETU and the exposure time is calculated for control, obtaining a uniform resist pattern even when the film thickness varies.

Inventors:

ITOU TETSUO
TANUMA MASAYA
MOROOKA YASUO

Application Number:

JP11671182A

Publication Date:

January 17, 1984

Filing Date:

July 07, 1982

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

G03C5/08; G03F7/20; H01L21/027; H01L21/30; (IPC1-7): G03C5/08; H01L21/30

Attorney, Agent or Firm:

Kazuko Tomita (3 outside)

Next Patent: REDUCED PROJECTION TYPE EXPOSING DEVICE