Title:
DEVICE AND METHOD OF FORMING SLOT TRANSFER
Document Type and Number:
Japanese Patent JPS5932140
Kind Code:
A
Abstract:
An improved means and method is provided for encapsulating electronic devices and other objects by transfer molding. The mold cavities are arranged in rows, disposed adjacent to and parallel with slot-shaped encapsulant reservoirs, and coupled to the reservoirs by short feeder channels of uniform length. Preferably, a row of cavities is located in a mirror symmetric fashion on either side of and parallel with each slot-shaped reservoir. A tightly fitting blade moves in each slot-shaped reservoir to compress and liquify the plastic encapsulant charge, injecting it into the mold cavities containing the component to be encapsulated. Plastic utilization can exceed 90%, and better control over molding conditions can be obtained because the plastic material reaches each mold cavity at the same stage of the liquification-solidification cycle. More cavities can be fitted in a given mold area because the usual central material pot and runner-tree are eliminated.
More Like This:
Inventors:
PURESUTON JIEI HAINRU
Application Number:
JP13424783A
Publication Date:
February 21, 1984
Filing Date:
July 22, 1983
Export Citation:
Assignee:
MOTOROLA INC
International Classes:
B29C43/00; B29C45/00; B29C45/02; B29C45/14; B29C45/26; H01L21/56; H05K13/00; (IPC1-7): B29G3/00; H01L21/56
Attorney, Agent or Firm:
Kugoro Tamamushi