Title:
WAFER TRANSFER MECHANISM
Document Type and Number:
Japanese Patent JPS5961943
Kind Code:
A
Abstract:
PURPOSE:To quickly transfer wafers under the high quality condition by providing a plurality of transfer promotion wheels on the transfer path. CONSTITUTION:The guide rails 33 provided in parallel along the transfer direction of the transfer path are curved in the form of character as in the sectional view on the opposing internal wall suface, forming a wafer accommodating groove 33a. A plurality of transfer promoting wheels 34 which are provided in such a manner that the circumferential part is exposed to the transfer surface 27 in the transfer path has the rotating function like a ball bearing and thereby smoothly transfers the wafer 24. Therefore, the wafer 24 is very smoothly supplied to the wafer accommodating part 26a utilizing the inclined condition of the heating chamber 21, feed effect by the transfer promoting wheels 34 provided on the transfer path and a weight of wafer itself 24. Thereby, the wafer can be quickly transferred under the high quality condition, ensuring improvement in productivity.
Inventors:
MATSUO TOSHIYUKI
Application Number:
JP17276882A
Publication Date:
April 09, 1984
Filing Date:
October 01, 1982
Export Citation:
Assignee:
TOSHIBA KK
International Classes:
H01L21/677; H01L21/68; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
Takehiko Suzue
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