PURPOSE: To prevent power loss and heat insulation and to facilitate wiring connection by providing connecting wirings of a heater to an IC on the upper and lower surface sides of a film carrier tape, thereby reducing the number of wirings at the both sides to increase the width of the wirings.

CONSTITUTION: A film carrier tape 7 is formed of a laminate, upper and lower layers are, for example, formed as polyimide substrates 14, 14', and the number of the wirings 12 to signal electrodes 10 to a heater 8 and an IC chip 4 such as, for example, leads 15, 15' of copper foils are bonded. The substrates 14, 14' and leads 15, 15' are aligned at the side of the electrode 10 substantially on the same line, and slightly displaced at the upper and lower positions at the wirings 12 side. The connection of the leads 15, 15' and signal electrodes 10 and the wirings 12 is so-called beam leading type in the former, and a wire bonding system with wirings 13 in the latter.