PURPOSE: To realize an unexpensive resin mold coil while maintaining its excellent corona property, by providing a boundary layer between a resin layer and an end of a conductive coil for preventing liquid resin from entering inside of the conductive coil.
CONSTITUTION: Patty-like resin with high viscosity is applied on an end of a conductive coil 2 for forming a boundary layer 10, so that the whole surface of the end of the conductive coil 2 except for the section covered with thin film insulator 5 and 6 is covered with the putty-like resin. After application of the putty-like resin, liquid resin is injected into a space based by the boundary layer 10 and enclosed by the sections of the insulators 5 and 6 protruded from the coil ends. This is brought into a curing oven in which the liquid resin forming the resin layer 9 and the putty-like resin forming the boundary layer 10 are heat- cured. Thus the resin mold coil is given an excellent colona property since it does not have any resin inside of the conductive coil. Moreover, the resin mold coil can be unexpensive since expensive putty-resin is used in very small quantity necessary for forming the boundary layer.
NAKAMURA MAMORU
IGARASHI TAKASHI
TAKIMOTO MASAAKI
