PURPOSE: To enable to reduce the magnitude of an electrode pad having a pin to small size by forming a flange on the portion separated at a slight interval from the bonding surface of a terminal pin, and bonding them by an insulator such as an adhesive.

CONSTITUTION: A base end 5c of a terminal pin 5 for forming the end bonding surface reduced in relatively small size is projected slightly from the flange 5b of the pin 5, the size of an electrode pad 4 having a pin is increased slightly corresponding to the bonding surface of the base end, the both are bonded by electrically and mechanically brazing the surface of the pad 4 and the surface of the end 5c of the pin 5, and then mechanically bonded by an insulator 7 such as an adhesive between the lower surface of the flange 5b and the surface of an insulating substrate 1 around the pad 4 including the brazed surface. Thus, the bonding strength of the terminal pin to the pad can be sufficiently obtained, and the size of the bonding portion of the pad and the pin can be sufficiently reduced.