PURPOSE: To reduce the working time and prevent the bending or disconnection of a substrate, by sticking a transparent film whereon a UV hardening type adhesive is applied over a through hole for containing a semiconductor element of a circuit substrate and hardening the adhesive by a UV lamp before a connection.

CONSTITUTION: The transparent film 14 whereon the UV hardening adhesive 13 is applied is stuck over the transparent hole 11 for the element 10 of the circuit substrate 12, and the element 10 is softly pressed. The adhesive 13 is hardened by irradiation by the UV lamp 15, a frame 16 whereon the UV hardening adhesive is applied is installed, and connections W are performed. Next, a UV hardening type resin 18 (intercepting visible lights by coloring) is injected, and the resin 18 and 17 are perfectly hardened by irradiating by the UV lamp 19. The inside of the resin 18 is hardened by the anaerobiotic property. When the UV type adhesive or a sealant is used, the work is finished in a short time. Besides, since a high temperature is not applied, the bending or disconnections of a substrate can be prevented.