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Patent Searching and Data


Title:
TEMPERATURE SENSOR FOR COOKING APPLIANCE
Document Type and Number:
Japanese Patent JPH04136727
Kind Code:
A
Abstract:
PURPOSE:To prevent a stress crack due to a difference in a thermal expansion coefficient at a high temperature by not bonding an insulator and components of a tubular element together. CONSTITUTION:A contact part 9 is buried in a powdery magnesium oxide of an insulator 12 packed in a tubular element 11 of a head 23 and the opening of the tubular element 11 is blocked up by a cover 13, while the head 23 is bonded to a rigid body 2 by welding or the like and supported on a support plate 14 with a spring body 15 interposed. In the head 23 thus constructed, the tubular element 11 is constructed integrally in the central part of a disk body. Since the insulator 12 is not bonded to the head 23, unlike a conventional one, and is powdery, a stress due to differences in a thermal expansion coefficient among the insulator 12, the rigid body 2, the support plate 14, etc. is absorbed by the insulator 12, no stress crack is caused even at a high temperature.

Inventors:
SASADA KATSUMI
OCHI KENZO
UEDA YASUKIYO
Application Number:
JP17513590A
Publication Date:
May 11, 1992
Filing Date:
July 02, 1990
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01K1/08; A47J36/00; F27D21/00; G01K7/00; G01K7/02; (IPC1-7): A47J36/00; F27D21/00; G01K1/08; G01K7/00; G01K7/02
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)