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Patent Searching and Data


Title:
MOLDING PROCESS OF ORGANIC SUBSTANCE
Document Type and Number:
Japanese Patent JPS6030310
Kind Code:
A
Abstract:

PURPOSE: To mold effectively organic substance at low cost with little consumed energy, using simple mold by a method in which after the mixture of an organic substance and a binder have been adsorbed on the surface of a model by the suction effect under reduced pressure, it is pushed and then the mixture is solidified, causing a curing agent to flow through the mixture.

CONSTITUTION: The mixture M of the organic substance in the state of fiber, powder or the composite thereof (e.g. cotton waste, wooden powder, etc.) and a binder (e.g. phenol, the condensation polymer of formaldehyde, etc.) is received in a vessel 1. On said vessel 1, the bottom force 3 covered with a net 3 at its surface is placed, turning over the bottom force by 180°. Thereafter, the vessel 1 and the bottom force 3 are reversed by 180°, and the inner pressure of the hollow chamber 4 of the bottom force is reduced, whereby the suction through a piercing narrow holes 5 and the metallic net 2 is achieved. When they are again turned over by 180°, the mixture M is adsorbed on the surface of the bottom force 3. The bottom force 3 is removed from the vessel 1, and after it has been turned over by 180°, the mixture is pushed under 1W10kg/cm2 pressure by a top force 6. The gaseous curing agent with 0.1W10kg/cm2 pressure is supplied into a hollow chamber 8 from the penetrated hole 7 of the top force and is caused to flow through the mixture M, injecting the curing agent from penetrated narrow holes 9, thereby curing the binder in the mixture M and solidifying the mixture M.


Inventors:
NISHIKAWA KAZUYUKI
MAKIGUCHI TADASHI
Application Number:
JP10982183A
Publication Date:
February 15, 1985
Filing Date:
June 17, 1983
Export Citation:
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Assignee:
SINTOKOGIO LTD
International Classes:
B27N3/08; B27N5/00; (IPC1-7): B27N3/08