PURPOSE: To provide catalyst carrier having a honeycomb structure excellent in heat impact resistance obtained by forming the coating layer of activated alumina on the surface of the honeycomb structure while microcrack voids of the ceramic honeycomb structure are maintained.
CONSTITUTION: A honeycomb structure 1 comprising ceramic such as cordierite and having plural macrobores 2 on the surface thereof an microcracks 3 generated from bottom parts of macrobores 2 is fabricated. In the next stage, a coating film comprising, for example, methyl cellulose is formed on the surface of this structure 1 and the resulting coated structure 1 is immersed in a slurry for an activated alumina coating and baked after drying. As the result, the aforementioned coating film is baked off to form an activated alumina coating layer 4 on the surface of the structure containing macrobores and voids of cracks 3 are remained.
| JP2018538132 | Carrier interface void concentrated buried SCR catalyst structure |
| JP2020049461 | AMMONIA SLIP CATALYST |
OKAMOTO KUNIO
ISOMURA KEIICHIROU
| JPS5651245A | 1981-05-08 | |||
| JPS49115091A | 1974-11-02 |
| US3979216A | 1976-09-07 |