Title:
TOOL FOR PACKAGING SUBSTRATE AND METHOD FOR POSITIONING SUBSTRATE
Document Type and Number:
Japanese Patent JP2004119537
Kind Code:
A
Abstract:
To remove a margin substrate part from a substrate on which electronic components are to be packaged by a packaging machine.
The peripheral edge of the substrate K is engaged with a substrate packaging tool 10. Packaging reference holes 38 are formed on the tool 10, and packaging reference pins 36 of a base plate 34 highly accurately attached to the packaging machine are inserted into the holes 38 to position the tool 10 on the packaging machine. Since the substrate K is positioned in the frame of the tool 10, the substrate K is accurately positioned on the packaging machine. Consequently, it is unnecessary to form a marginal substrate on the substrate K.
Inventors:
NAGASHIMA AKIO
Application Number:
JP2002278396A
Publication Date:
April 15, 2004
Filing Date:
September 25, 2002
Export Citation:
Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda