Title:
TOOL FOR WAFER PROCESSING
Document Type and Number:
Japanese Patent JPS54159170
Kind Code:
A
Abstract:
PURPOSE:To establish the tool in common use with heat treatment and other treatments, by forming through-hole and grooves at the cylindrical wall of semiconductor crystal or its oxide. CONSTITUTION:The hollow cylinder of semiconductor single crystal, polycrystal or oxide crystal as material is divided into three equally, and the rectangular hole 5 is made at the center of the arc plate 1. The width of the hole 5 is made greater than the bottom plane 3 of the external circumference 2 at the both ends of the hole. The substrate containing grooves 6 are placed on the inner circumference surface in a given distance. The depth of the grooves is taken slightly broader than the thickness of substrate and the opening gas the taper 8. By taking the one side surface A of the tool as reference, the tool is provided at a given pitch, and one of them is made for dummy substrate. The tool of construction like this is possible for accurate machining, the center of weight is stable, and it can be commonly used heat treatment or the like by commonly using suitable carrying tool, and it is suited to the automatization of processing.
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Inventors:
NAGATOMO HIROTO
TAKAGAKI TETSUYA
SEKI HISAO
TAKAGAKI TETSUYA
SEKI HISAO
Application Number:
JP6778278A
Publication Date:
December 15, 1979
Filing Date:
June 07, 1978
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/673; H01L21/22; H01L21/68; (IPC1-7): H01L21/22; H01L21/68
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