Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3112227
Kind Code:
B2
Inventors:
Takaaki Mitsui
Kajiyama et al.
Jun Shiraishi
Hideshi Hanada
Kajiyama et al.
Jun Shiraishi
Hideshi Hanada
Application Number:
JP986594A
Publication Date:
November 27, 2000
Filing Date:
January 31, 1994
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
B29C45/02; B29C45/14; H01L21/56; H01L23/28; H01L23/50; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/14; H01L23/28; H01L23/50
Domestic Patent References:
| JP4196330A | ||||
| JP4747A | ||||
| JP7135230A | ||||
| JP7214598A |
Attorney, Agent or Firm:
Takahisa Kimura
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