Title:
HEAT-RESISTANT ELECTRICALLY-INSULATING FILM
Document Type and Number:
Japanese Patent JP3171644
Kind Code:
B2
Abstract:
PURPOSE: To obtain the title film excellent in heat resistance by subjecting to a specific treatment an extrudate obtd. by melt extrusion of a mixture of a specific copolymer and a specific Polysilicone.
CONSTITUTION: A mixture of a copolymer of propylene and an alkenylsilane (e.g. vinylsilane) with a polysilicone contg. Si-H groups (e.g. polyphenylsilicone obtd. by reacting phenyldichlorosilane with water) is melt-extruded to obtain an extrudate, which is then at least monoaxially stretched to form a film, which is then treated with a catalyst (e.g. n-butyl titanate), pref. by dipping the film in a soln. of the catalyst in a solvent (e.g. toluene).
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Inventors:
Tadashi Asanuma
Kazuhiko Yamamoto
Kazuhiko Yamamoto
Application Number:
JP9397292A
Publication Date:
May 28, 2001
Filing Date:
April 14, 1992
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
B29C55/02; C08J5/18; C08J7/00; C08L23/12; C08L83/06; C08L83/07; C08L87/00; H01B3/46; H01B17/60; B29K23/00; B29L7/00; (IPC1-7): C08J7/00; B29C55/02; C08J5/18; C08L23/12; C08L83/06; H01B3/46; H01B17/60
Domestic Patent References:
| JP5262891A | ||||
| JP550500A | ||||
| JP524106A |