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Patent Searching and Data


Title:
TOPCOAT COMPOSITION FOR RESIST FILM AND PATTERN FORMING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2010107793
Kind Code:
A
Abstract:

To provide a topcoat composition for a photoresist film, the composition having an enhanced function of a compound having an Si atom and/or an F atom to be used together with an alkali-soluble resin in a photoresist film for liquid immersion exposure, and to provide a pattern forming method using the topcoat composition for a resist film.

The topcoat composition for the resist film contains components of: (A) an alkali-soluble resin; (B) a compound having an Si atom and/or an F atom; (C) a solvent having a boiling point of lower than 175C; and (D) an additive expressed by formula (1). The pattern forming method is carried out by using the composition. In formula (1), R1 and R2 each independently represents a 4-6C alkyl group; X represents a 1-4C alkylene group or -(C=O)-Y-(C=O)- group; and Y represents a 1-4C alkylene group.


Inventors:
HIRAOKA HIDETOSHI
Application Number:
JP2008280751A
Publication Date:
May 13, 2010
Filing Date:
October 31, 2008
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/11; G03F7/38; H01L21/027
Attorney, Agent or Firm:
Yasuhiro Noguchi
Akiko Deep Sea