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Title:
タッチパネルの製造方法
Document Type and Number:
Japanese Patent JP4942566
Kind Code:
B2
Abstract:

To provide a manufacturing method of a touch panel capable of maintaining strong bonding force even under high humidity and enhancing reliability of electric connection after hardening of a bonding agent.

In the manufacturing method of the touch panel wherein a pair of substrates 11, 12 faced with each other and pasted together are arranged, and wiring conductors 25c, 25d formed on one glass substrate 11 and framed electrodes 23, 23 formed on the other film substrate 12 are electrically connected with each other via a silicone bonding agent, the conductive bonding agent is a silicone bonding agent including silver particles, and the silicone bonding agent wherein the silver particles include larger granular powder or scale-shaped powder with a particle size of 10 to 90 micrometers and smaller granular powder or scale-shaped powder with a particle size of 1 to 20 micrometers at a weight ratio of 50:50 to 2:98 is used. The silicone bonding agent is hardened by being heated within a temperature range of 100 to 130 °C, for 30 to 180 minutes, and the wiring conductors 25c, 25d and framed electrodes 23, 23 are respectively connected with each other.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Genichi Matsuda
Application Number:
JP2007172726A
Publication Date:
May 30, 2012
Filing Date:
June 29, 2007
Export Citation:
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Assignee:
FUJITSU COMPONENT CO., LTD.
International Classes:
H01H11/00; C09J7/00; C09J7/02; C09J11/04; C09J183/04; C09J183/05; G06F3/041; H01H13/712; H01B1/00; H01B1/22
Domestic Patent References:
JP2007053031A
JP2002322363A
JP11066953A
JP11054894A
JP2005054157A
JP2003129017A
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Hirose Shigeki



 
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